iFixit's move to disassemble one of the first iPhones sold in the world has revealed some of the details of what's inside, with components from Intel and others revealed.
Initial analysis reveals Apple sourced components from TriQuint Semiconductor, Intel, Samsung, Infineon, ARM, SST and Skyworks, among others.
TriQuint is a new supplier offering a range of components for the iPhone 3G's telephony features, including parts for UMTS, HSUPA and WCDMA/HSUPA.
Flash memory has been provided by Intel, at least in the model disassembled over night. The processor combines a Samsung ARM-based chip with the flash memory.
EE times plans to later publish a initial tear-down analysis from Portelligent.
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